COSTA MESA, Calif., May 16, 2024 /PRNewswire/ -- Viking Technology, a division of Sanmina Corporation (SANM), announces their newly released 16GB DDR4 Multi-Chip Package (MCP). This high-density MCP ...
Raytheon, an RTX company, has received a $20 million contract from the Strategic and Spectrum Missions Advanced Resilient Trusted Systems (S2MARTS) consortium to develop a next-generation multi-chip ...
STMicroelectronics (NYSE: STM), among the world’s largest suppliers of NOR Flash devices and a leading developer of technologies based on fine-process geometries, today announced NOR Flash-based ...
South Korean memory maker SK Hynix saw its exports of multi-chip packages (MCP) fall by nearly 30% sequentially in January 2025. At the same time, some analysts believe that after two years of rapid ...
In recent years there has been a sharp rise of multi-die system designs. Numerous publications targeting a large variety of applications exist in the public domain. One presentation [2] on the IEEE’s ...
Toshiba Corp. has developed a new chip production technology that increases by 50 percent the number of layers of components that can be crammed inside a standard Multi Chip Package (MCP) for use in ...
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